Samsung Electronics announced that it has started mass production of the most advanced DDR4 memory modules with a size of 8 Gb, and together with them it has started the production of the first 32 GB DDR4 RAM modules intended for corporate servers. These new RAMs are manufactured using the new 20-nm manufacturing process, which is the same process used to manufacture even the most advanced mobile processors today. Samsung claims that these memory modules meet all the requirements of high performance, high density and energy saving in next-generation corporate servers.
In addition, with the new 8Gb DDR4 modules, Samsung finalized the entire line-up of DRAM modules manufactured using the 20-nm manufacturing process. Today, this series includes 6Gb LPDDR3 for mobile devices and 4Gb DDR3 modules for PCs. Then, as mentioned above, Samsung is starting to produce 32GB RDIMM memory modules that offer a transfer rate of 2 Mbps per pin, which represents a 400% percent increase in performance when compared to the 29 Mbps transfer rate of server DDR1 memory. But the capabilities of this technology do not stop at 866 GB, and Samsung stated that using 3D TSV technology, it is possible to develop a memory module of up to 32 GB. The advantage of the new modules is also the mentioned lower consumption, since these DDR3 chips require 128 volts, which is currently the lowest possible voltage.
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*Source: Samsung
