The American company Qualcomm is known primarily as a manufacturer of mobile chips, but its scope is wider - it also "makes" fingerprint sensors, for example. And she presented a new one at the ongoing CES 2021. More precisely, it is the second generation of the 3D Sonic Sensor sub-display reader, which is supposed to be 50% faster than the first generation sensor.
The new generation 3D Sonic Sensor is 77% larger than its predecessor – it occupies an area of 64 mm2 (8×8 mm) and is only 0,2 mm thin, so it will be possible to integrate it even into the flexible displays of folding phones. According to Qualcomm, the larger size will allow the reader to collect 1,7 times more biometric data, as there will be more room for the user's finger. The company also claims that the sensor is able to process data 50% faster than the old one, so it should unlock phones faster.
3D Sonic Sensor Gen 2 uses ultrasound to sense the back and pores of the finger for increased safety. However, the new version is still significantly smaller than the 3D Sonic Max sensor, which covers an area of 600mm2 and can verify two fingerprints at once.
Qualcomm expects the new sensor to start appearing in phones early this year. And given that Samsung already used the last generation of the reader, it is not excluded that the new one will already appear in the smartphones of its next flagship series Galaxy S21 (S30). It will be presented already this week on Thursday.
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