We all knew that the company's new flagship would be powered by the latest Exynos 2200 SoC in some markets and Snapdragon 8 Gen 1 in others, but we had no idea that it would need redesigned cooling. However, Samsung has significantly redesigned it and it should help with higher performance, among other things.
Galaxy The S22 Ultra uses a new thermal paste that is able to transfer heat 3,5x more efficiently. Samsung calls it "Gel-TIM". Above it is the "Nano-TIM", a component that shields electromagnetic interference. It also transfers heat to the evaporation chamber more efficiently and is more resistant to pressure than similar solutions previously used.
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The overall design is also new. The "vapor chamber" used to be only on the printed circuit board (PCB), but now it covers a wider area from the application processor to the battery, which of course improves heat transfer. It's made of double-bonded stainless steel, so it's also thinner and more durable overall. The entire cooling solution is finished with a wide graphite sheet that dissipates heat from the chamber itself.
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It will be interesting to see how this all plays out in real-world use. Better cooling usually means that the contained chipset can work at maximum performance for a longer period of time, and as you know, not only Samsung's Exynos chipsets have had their shortcomings in this area. Virtually every smartphone heats up under heavy load, including Apple's iPhones.
Newly introduced Samsung products will be available for purchase, for example, on Alza
