Both chipsets used in the series phones Galaxy S22, Exynos 2200 and Snapdragon 8 Gen 1, are power-hungry and overheat, resulting in disappointing gaming performance and poor battery life. Almost all other flagships face this problem Android phones from this year. However, Samsung's upcoming foldable smartphones could avoid them.
According to a respected Ice universe leaker, there will be "benders" Galaxy From Fold4 a From Flip4 powered by the Snapdragon 8 Gen 1+ chipset (sometimes listed as Snapdragon 8 Gen 1 Plus). Qualcomm hasn't unveiled the chip yet, but according to anecdotal reports, it's built on TSMC's 4nm process, making it more power-efficient compared to the Exynos 2200 and Snapdragon 8 Gen 1 (these chips are manufactured using Samsung's 4nm process).
Gallery
The semiconductor chip manufacturing technology at TSMC's factories has always been superior to that used by Samsung's foundry division, Samsung Foundry. It is not surprising that the Taiwanese semiconductor giant has also chosen to manufacture its A and M series chipsets in the next few years. Apple.
You could be interested in
While this is certainly disappointing for the Samsung Foundry, for the Samsung MX (Mobile Experience) division, which manufactures smartphones and tablets among other things Galaxy, on the contrary, it is good news. It can be expected that Galaxy Z Fold4 and Z Flip4 will offer higher performance and battery life than the series Galaxy S22 and the current generation of Samsung "puzzles".
