Just a few days after the introduction of Samsung's new foldable smartphone Galaxy His first analysis of Flip4 appeared on the Internet. The video shows what is hidden inside the new "bender" and what is different compared to its predecessor.
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A teardown of the fourth Flip, posted by YouTuber PBKReviews, shows just how well the Korean giant's new flip phone is built. The back part can be removed with a tool. After carefully removing it, the motherboard can be removed - after disconnecting a few flex cables and Philips screws.
The video shows how Samsung changed the position of several things compared to the third Flip. It also reveals that the Flip4 has a bigger battery and one extra millimeter wave 5G antenna. The sensor of the main camera is also larger. Samsung used a double-sided motherboard that houses most of the phone's chips, including the chipset Snapdragon 8+ Gen1, operating memory and storage. A graphite layer covers the board on both sides, which helps dissipate heat. The wireless charging coil and NFC chip are located on top of the main battery.
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The sub-board, on which the USB-C port, microphone and speaker are located, is connected to the motherboard using a flex cable. The speaker seems to have some sort of foam balls that make it seem louder than it actually is. Batteries can typically only be removed after applying isopropyl alcohol.
